首页> 外国专利> Film thickness measuring method, the film thickness measuring apparatus and an image forming apparatus having the film thickness measuring device, and manufacturing method and the photoconductive photosensitive member of photoconductive photoconductive

Film thickness measuring method, the film thickness measuring apparatus and an image forming apparatus having the film thickness measuring device, and manufacturing method and the photoconductive photosensitive member of photoconductive photoconductive

机译:膜厚测定方法,具有该膜厚测定装置的膜厚测定装置和图像形成装置,以及光导性光电导材料的制造方法和光导性感光体

摘要

PROBLEM TO BE SOLVED: To simultaneously, highly accurately, and surely measure a film thickness of a surface layer into which fine particles of filler are dispersed and a film thickness of a photosensitive layer containing a surface layer into which fine particles of filler are dispersed in a photoconductive photoreceptor.;SOLUTION: In measuring a film thickness of the photoconductive photoreceptor with an intermediate layer and a photosensitive layer in which a portion of a predetermined thickness of the photosensitive layer is formed as a surface layer, light from a light source is vertically entered into the photoconductive photoreceptor; first interference light between first reflection reflected at a surface of the surface layer and second reflection reflected at a surface of the intermediate layer and second interference light between the first reflection and third reflection reflected at a surface of the surface layer in the side of the intermediate layer among incident light are directed to a spectroscopic means and subjected to dispersion; an interference waveform is obtained by expanding a reflectance to an optional size when computing the reflectance from the dispersed spectrum intensity; and the film thickness of the surface layer is computer-calculated based on low frequency components of the interference waveform and the film thickness of the photosensitive layer is computer-calculated based on high frequency components of the interference waveform.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:为了同时,高精度且可靠地测量分散有填充剂细颗粒的表面层的膜厚和包含分散有填充剂细颗粒的表面层的感光层的膜厚。解决方案:在通过中间层和感光层(其中预定厚度的感光层的一部分形成为表面层)的感光层的膜厚进行测量时,来自光源的光垂直进入光电导感光器;在表面层的表面处反射的第一反射和在中间层的表面处反射的第二反射之间的第一干涉光以及在中间层的侧面处的表面层的表面处反射的第一反射和第三反射之间的第二干涉光入射光中的层被引导到光谱装置并进行色散。当从分散的光谱强度计算反射率时,通过将反射率扩展到任意大小来获得干涉波形;并基于干扰波形的低频分量计算机计算表面层的膜厚,并基于干扰波形的高频分量计算机计算感光层的膜厚。;版权所有:(C)2011 ,JPO&INPIT

著录项

  • 公开/公告号JP5521607B2

    专利类型

  • 公开/公告日2014-06-18

    原文格式PDF

  • 申请/专利权人 株式会社リコー;

    申请/专利号JP20100028921

  • 发明设计人 友田 光弘;

    申请日2010-02-12

  • 分类号G01B11/06;G03G5/14;G03G5/147;G03G5/00;G03G5/10;G03G21/00;

  • 国家 JP

  • 入库时间 2022-08-21 16:17:02

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