首页> 外国专利> The soft Characteristic printed circuit substrate which possesses the soft Characteristic metal Hari laminate, and the said soft Characteristic metal Hari laminate which include the film and the said film which include fully aromatic polyester amide copolymer resin and the said resin

The soft Characteristic printed circuit substrate which possesses the soft Characteristic metal Hari laminate, and the said soft Characteristic metal Hari laminate which include the film and the said film which include fully aromatic polyester amide copolymer resin and the said resin

机译:具备软特性金属Hari层叠体的软特性印刷电路基板,以及包括包含全芳香族聚酯酰胺共聚物树脂和上述树脂的膜和上述膜的上述软特性金属Hari层叠体。

摘要

To relate to the soft Characteristic printed circuit substrate which possesses the soft Characteristic metal Hari laminate, and the said soft Characteristic metal Hari laminate which include the high-molecular film and the said high-molecular film which include fully aromatic polyester amide copolymer resin and the said fully aromatic polyester amide copolymer resin, the said fully aromatic polyester amide copolymer resin the iteration unit which is induced from the iteration unit (A)5 - 25 mol sections which are induced from the aromatic hydroxycarboxylic acid and the aromatic amine which possesses the phenolic hydroxyl basis the iteration unit which is induced from (B) and aromatic diamine (B') at least one which is chosen from the group which consists of iteration unit 37.5 - 47.5 molsIt includes with the section and the iteration unit (C)37.5 - 47.5 mol sections which are induced from aromatic di-carboxylic acid.
机译:本发明涉及一种具有软特性金属Hari层叠体的软特性印刷电路基板,以及包括高分子薄膜的所述软特性金属Hari层叠体,以及包含全芳香族聚酯酰胺共聚物树脂和高分子薄膜的所述高分子薄膜。所述的完全芳族聚酯酰胺共聚物树脂,所述的完全芳族聚酯酰胺共聚物树脂是由重复单元(A)产生的重复单元,由具有芳香族羟基羧酸和具有酚类的芳族胺产生的5-25摩尔部分。羟基(B)和芳族二胺(B')衍生出的迭代单元至少为37.5-47.5 mols由迭代单元组成的组中包括(C)段和迭代单元37.5-由芳族二羧酸引发的47.5mol的部分。

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