首页> 外国专利> WHOLLY AROMATIC POLYESTER AMIDE COPOLYMER RESIN, POLYMER FILM INCLUDING THE WHOLLY AROMATIC POLYESTER AMIDE COPOLYMER RESIN, FLEXIBLE METAL-CLAD LAMINATE INCLUDING THE POLYMER FILM, AND FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING THE FLEXIBLE METAL-CLAD LAMINATE

WHOLLY AROMATIC POLYESTER AMIDE COPOLYMER RESIN, POLYMER FILM INCLUDING THE WHOLLY AROMATIC POLYESTER AMIDE COPOLYMER RESIN, FLEXIBLE METAL-CLAD LAMINATE INCLUDING THE POLYMER FILM, AND FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING THE FLEXIBLE METAL-CLAD LAMINATE

机译:全芳族聚酰胺酰胺共聚物树脂,包括全膜的芳族聚酰胺树脂,包括聚合物膜的柔性金属层压板,以及包括柔性金属板的柔性印刷电路板

摘要

Disclosed are a wholly aromatic polyester amide copolymer resin, a polymer film including said wholly aromatic polyester amide copolymer resin, a flexible metal-clad laminate including said polymer film, and a flexible printed circuit board including said flexible metal-clad laminate. The wholly aromatic polyester amide copolymer resin comprises: 5-25 moles of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 moles of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxy group and a repeating unit (B') derived from an aromatic diamine; 20-40 moles of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 moles of a repeating unit (D) derived from an aromatic diol; and 5-20 moles of a repeating unit (E) derived from an aromatic amino carboxylic acid.
机译:公开了一种全芳族聚酯酰胺共聚物树脂,包括所述全芳族聚酯酰胺共聚物树脂的聚合物膜,包括所述聚合物膜的柔性覆金属层压板,以及包括所述柔性覆金属层压板的柔性印刷电路板。全芳族聚酯酰胺共聚物树脂包含:5-25摩尔衍生自芳族羟基羧酸的重复单元(A);和20-40摩尔的至少一种选自由具有酚羟基的芳族胺衍生的重复单元(B)和由芳族二胺衍生的重复单元(B')组成的组中的至少一个重复单元; 20-40摩尔衍生自芳族二羧酸的重复单元(C); 5-20摩尔衍生自芳族二醇的重复单元(D); 5-20摩尔的衍生自芳族氨基羧酸的重复单元(E)。

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