It is low restoration of the dielectric of the dielectricity which receives the plasma damage with the photochemical accumulation of ULTRAVIOLET RADIATION support type ratio membrane

摘要

Low the method of making the dielectricity which receives the damage ratio membrane recover is offered. Low the damage of the dielectricity ratio membrane, occurs while processing the membrane such as etching, ashing, and while levelling. It is low, when the dielectricity ratio membrane is processed, the water accumulates in the hole of the membrane, furthermore hydrophilic chemical compound is formed inside dielectricity ratio membrane structure low. The recovery which installs ultraviolet ray (ULTRAVIOLET RADIATION) emission and carbon content chemical compound removes the water from these holes, furthermore removes hydrophilic chemical compound low from dielectricity ratio membrane structure.