Sealed small form factor optical device packaging for plastic optical fiber networks

摘要

An apparatus includes an enclosure configured to contain at least one optoelectronic device and to interface the at least one optoelectronic device to a polymer-clad silica (PCS) optical fiber. The enclosure includes a first section that includes a base portion and a wall portion. The wall portion is coupled to the base portion. The wall portion defines an open-ended slot that is configured to receive a first portion of a PCS optical fiber lead extending through the wall portion. A second section is configured to sealingly engage a first edge of the wall portion and the first portion of the PCS optical fiber lead. Passive alignment of PCS optical fiber leads to optoelectronic devices inside the package is accomplished using special designed precision mold ceramic block with integral U-grooves.