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For horizontal injection die-casting equipment and die-casting method

机译:用于卧式压铸设备和压铸方法

摘要

PROBLEM TO BE SOLVED: To provide a horizontal injection die casting apparatus which prevents the entry of molten metal into a clearance between the outer peripheral surface of a plunger chip and the inner peripheral surface of a sleeve hole.;SOLUTION: A horizontal injection die casting apparatus 1 includes a fixed mold 3 and a movable mold 4 for defining a cavity 7 together with the fixed mold 3. Furthermore, it includes a mold sleeve 9 engaged with the fixed mold 3, a sleeve 11 on the side of a casting machine that is connected with the mold sleeve 9, and a plunger chip 12 that advances in a horizontal direction within the sleeve 11 on the side of the casting machine and the mold sleeve 9 and injects the molten metal to the cavity 7. The mold sleeve 9 has a sleeve hole 9B, wherein the diameter D2 of the rear end 9B1 of the sleeve hole 9B is formed larger than the inside diameter D1 of the sleeve 11 on the side of the casting machine, and the diameter D3 of the sleeve hole 9B at the maximum advancing position of the plunger chip 12 is formed smaller than the diameter D2 of the rear end 9B1 of the sleeve hole 9B.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种水平注射压铸装置,其防止熔融金属进入柱塞芯片的外周表面与套筒孔的内周表面之间的间隙。设备1包括固定模具3和用于与固定模具3一起限定腔7的可移动模具4。此外,其包括与固定模具3接合的模具套筒9,在铸造机侧的套筒11,该模具套筒9与固定模具3接合。模具套筒9与模具套筒9连接,并且柱塞芯片12在铸造机侧的套筒11内在模具套筒9内沿水平方向行进并且将熔融金属注入到型腔7中。模具套筒9具有套筒孔9B,其中,套筒孔9B的后端9B1的直径D2形成为比铸造机侧的套筒11的内径D1大,并且比套筒11的内径D3大。嘛柱塞芯片12的最大前进位置形成为小于套筒孔9B的后端9B1的直径D2 。;版权:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP5608103B2

    专利类型

  • 公开/公告日2014-10-15

    原文格式PDF

  • 申请/专利权人 リョービ株式会社;

    申请/专利号JP20110002665

  • 发明设计人 水草 康行;

    申请日2011-01-11

  • 分类号B22D17/20;

  • 国家 JP

  • 入库时间 2022-08-21 16:15:38

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