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Method and integrated circuit package system for manufacturing an integrated circuit package system having a die on a base package
Method and integrated circuit package system for manufacturing an integrated circuit package system having a die on a base package
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机译:用于制造在基础封装上具有管芯的集成电路封装系统的方法和集成电路封装系统
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摘要
The present invention provides an integrated circuit package system with die on base package comprising forming a base package comprising, forming a substrate, mounting a first integrated circuit on the substrate, encapsulating the integrated circuit and the substrate with a molding compound, and testing the base package, attaching a bare die to the base package, connecting electrically the bare die to the substrate and encapsulating the bare die and the base package.
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