In the soft Characteristic circuit copper-clad laminate which includes the copper layer which is formed on the soft Characteristic circuit copper-clad

摘要

PROBLEM TO BE SOLVED: To provide a flexible circuit copper clad laminate showing excellence in etching property, peeling strength and curl characteristic.;SOLUTION: A flexible circuit copper clad laminate contains a polymer film 1, a tie coat layer 2 formed on at least one surface of the polymer film 1, and a copper layer 3 formed on the tie coat layer 2. The tie coat layer 2 is composed of an alloy containing: either one substance selected from iron, niobium and coba molybdenum; and nickel.;COPYRIGHT: (C)2013,JPO&INPIT