The solder ball implemental device, the solder ball implemental system which includes this and the solder ball implemental manner which uses this

摘要

Topic The solder ball implemental device, the solder ball implemental system which includes this and uses this the solder ball implemental manner which can implement on the etched circuit substrate easily without damaging the many solder ball are offered. SolutionsThe solder ball implemental device of this invention installing etched circuit substrate 300 in the upper surface, the table having the opening 210 where, corresponds to each pad of 100 which is converted to specified tilt angle of skew and etched circuit substrate 300 on etched circuit substrate 300 being superimposed in table and 100 the mask engaging in the both sides destal of 200 for implementation which is installed and mask 200 for implementation the solder ball circulatory organ 400 where it is installed on top of table, 100 sucks many solder ball 250 in one side destal of mask 200 for implementation, other than mask 200 for implementation it discharges in the side destal and,It is something which it includes. Choice figure Drawing 1