Tin and tin alloy plating bath, the electronic components that form the electrodeposition coating bath by the

摘要

PROBLEM TO BE SOLVED: To improve the appearance of an electrodeposited film and the uniformity of electrodeposition in a wide range of current density region and stabilize the composition ratio of a tin alloy film in a tin or tin alloy plating bath.;SOLUTION: The tin or tin alloy plating bath contains (A) a soluble salt composed of any of a tin salt and a mixture of a tin salt and a salt of a predetermined metal such as silver, copper, bismuth, and lead, (B) an acid or a salt thereof, and (C) a specific phenanthroline-dione compound. The film has excellent electrodeposition uniformity and good film appearance in a wide range of current density region because the phenanthroline-dione compound is contained. In the tin alloy plating, a uniform alloy composition can be obtained in a wide range of current density region.;COPYRIGHT: (C)2013,JPO&INPIT