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ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH
ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH
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机译:电解锡或锡合金镀液以及具有通过使用所说的镀液制成的电沉积物品的电子部件
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摘要
An electrodeposit formed by using a tin or tin alloy plating bath containing a prescribed branched polyoxyalkylene compound, such as an alkylene oxide adduct of aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom of an amine structure in a molecule, or an alkylene oxide adduct of glycerin or polyglycerin in which oxyalkylene chains are respectively bonded to a plurality of oxygen atoms of an alcohol structure in a molecule, suppresses formation defect such as abnormal growth of the electrodeposit. The electrodeposit also improves yield from the viewpoint of quality control.
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