首页> 外国专利> ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH

ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH

机译:电解锡或锡合金镀液以及具有通过使用所说的镀液制成的电沉积物品的电子部件

摘要

An electrodeposit formed by using a tin or tin alloy plating bath containing a prescribed branched polyoxyalkylene compound, such as an alkylene oxide adduct of aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom of an amine structure in a molecule, or an alkylene oxide adduct of glycerin or polyglycerin in which oxyalkylene chains are respectively bonded to a plurality of oxygen atoms of an alcohol structure in a molecule, suppresses formation defect such as abnormal growth of the electrodeposit. The electrodeposit also improves yield from the viewpoint of quality control.
机译:通过使用含有规定的支化聚氧化烯化合物的锡或锡合金镀浴形成的电沉积物,例如脂肪族单胺或多胺的烯化氧加合物,其中多个氧化烯链键合到分子中胺结构的氮原子上,或者其中氧化烯链分别键合到分子中的醇结构的多个氧原子上的甘油或聚甘油的环氧烷加合物,抑制了诸如电沉积物的异常生长的形成缺陷。从质量控制的观点来看,电沉积还提高了产率。

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