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Being the IIIV family semiconductor device null III-V family semiconductor device which

机译:作为IIIV系列半导体器件,没有III-V系列半导体器件,

摘要

According to one exemplary embodiment, a group III-V semiconductor device includes at least one transition layer situated over a substrate. The group III-V semiconductor device further includes a first strain-relieving interlayer situated over the at least one transition layer and a second strain-relieving interlayer situated over the first strain-relieving interlayer. The group III-V semiconductor device further includes a first group III-V semiconductor body situated over the second strain-relieving interlayer. The first and second strain-relieving interlayers comprise different semiconductor materials so as to reduce a strain in the first group III-V semiconductor body. The second strain-relieving interlayer can be substantially thinner than the first strain-relieving interlayer.
机译:根据一个示例性实施例,III-V族半导体器件包括位于衬底上方的至少一个过渡层。 III-V族半导体器件还包括位于至少一个过渡层之上的第一应变消除中间层和位于第一应变消除中间层之上的第二应变消除中间层。 III-V族半导体器件还包括位于第二应变消除中间层上方的第一III-V族半导体本体。第一和第二应力消除中间层包括不同的半导体材料,以减小第一III-V族半导体本体中的应力。第二应变消除中间层可以比第一应变消除中间层薄得多。

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