首页> 外国专利> Method of measuring the electrode surface modulus of the solid material and the sample -to- film adhesion evaluation method of the resin surface using the same

Method of measuring the electrode surface modulus of the solid material and the sample -to- film adhesion evaluation method of the resin surface using the same

机译:测量固体材料的电极表面模量的方法以及使用该方法测量树脂表面的样品与膜的粘附性的方法

摘要

PROBLEM TO BE SOLVED: To provide an evaluation method of elastic modulus of an extreme surface in a solid material sample.;SOLUTION: In a measuring method of elastic modulus of an extreme surface in a solid material sample such as resin film by using an atomic force microscope, a probe of an atomic force microscope is contacted at an elastic displacement as a displacement of a solid material sample within the range providing elastic deformation without providing plastic deformation to the solid material sample. Specifically, the elastic displacement is determined by contrasting a push-in step of measuring the relation between a push-in load on a probe when the probe is pushed in a resin film and a push-in displacement as a displacement of the resin film on this occasion, with a release step of measuring the relation between a release load when the probe pushed in the resin film is released due to decreased load and a release displacement as a displacement of the resin film on this occasion.;COPYRIGHT: (C)2012,JPO&INPIT
机译:要解决的问题:提供一种评估固体材料样品中极端表面弹性模量的方法。;解决方案:一种通过使用原子的方法来测量诸如树脂膜等固体材料样品中极端表面弹性模量的方法。力显微镜,原子力显微镜的探针以弹性位移接触,该位移是固体材料样品在提供弹性变形而不向固体材料样品提供塑性变形的范围内的位移。具体地,弹性位移通过将测量探针被推入树脂膜中时探针上的推入载荷与作为树脂膜在树脂上的位移的推入位移之间的关系进行测量的推入步骤进行对比来确定。在这种情况下,具有释放步骤,该步骤测量由于减小的载荷而使推入树脂膜中的探针被释放时的释放载荷与该情况下作为树脂膜的位移的释放位移之间的关系。 2012,日本特许厅

著录项

  • 公开/公告号JP5581905B2

    专利类型

  • 公开/公告日2014-09-03

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20100194974

  • 发明设计人 猪狩 敦;佐伯 典之;

    申请日2010-08-31

  • 分类号G01N3/00;G01N3/40;G01Q60/24;

  • 国家 JP

  • 入库时间 2022-08-21 16:13:22

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