The adhesion improver, the resin constituent, and these and the adhesion improver which contains the polyimide resin which

摘要

PROBLEM TO BE SOLVED: To provide an adhesion improver having heat resistance and exhibiting sufficiently good adhesion strength independent of the materials of the circuit members, a resin composition containing the same, and a method for producing a laminate including an adhesive layer comprising the adhesion improver or the resin composition laminated on an adherend.;SOLUTION: An adhesion improver includes a resin having a piperazine skeleton. The adhesion improver includes the resin having the piperazine skeleton, whose 5% weight loss temperature is ≥150°C.;COPYRIGHT: (C)2010,JPO&INPIT