首页> 外国专利> Adhesion improving modified polyalkylene terephthalate resin, the adhesion strength improved for the modified polyalkylene terephthalate resin composition, a resin molded product, and the conjugate

Adhesion improving modified polyalkylene terephthalate resin, the adhesion strength improved for the modified polyalkylene terephthalate resin composition, a resin molded product, and the conjugate

机译:改善粘合性的改性聚对苯二甲酸亚烷基二醇酯树脂,改善的改性聚对苯二甲酸亚烷基酯树脂组合物的粘合强度,树脂成型品和共轭物

摘要

To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to the total dicarboxylic acid component is at least 13 mol % and no more than 35 mol %. It is preferable if the modified polyalkylene terephthalate resin is a modified polybutylene terephthalate resin, and the aromatic dicarboxylic acid and/or an ester compound thereof is isophthalic acid and/or an ester compound thereof.
机译:提供一种改善包括聚对苯二甲酸亚烷基酯树脂的树脂成型品对硅粘合剂的粘合性的技术。使用聚对苯二甲酸亚烷基酯树脂,其中使对苯二甲酸以外的芳香族二羧酸和/或其酯化合物作为改性成分进行共聚,相对于全部二羧酸成分,改性成分的含量为13以上。摩尔%且不超过35摩尔%。改性聚对苯二甲酸亚烷基酯树脂优选为改性聚对苯二甲酸丁二酯树脂,芳香族二羧酸和/或其酯化合物为间苯二甲酸和/或其酯化合物。

著录项

  • 公开/公告号JP5744018B2

    专利类型

  • 公开/公告日2015-07-01

    原文格式PDF

  • 申请/专利权人 ウィンテックポリマー株式会社;

    申请/专利号JP20120519342

  • 发明设计人 坂田 耕一;

    申请日2011-05-31

  • 分类号C08G63/183;C08J5/12;

  • 国家 JP

  • 入库时间 2022-08-21 15:28:59

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