Production method and production device of solder plated wire

摘要

A process and apparatus for producing a solder-plated wire are provided with which it is possible to stably obtain a plated wire of desired quality including sufficiently lowered 0.2% proof stress and to thereby improve product yield and production efficiency. The apparatus (10) is configured of: a plating pretreatment means (2) in which a copper wire (1a) is pretreated in preparation for plating; a plating means (61) in which the surface of the copper wire (1a) is plated with a solder; and a winding means (71) for winding the copper wire (1a, 1b) having the plated surface. The plating pretreatment means (2) includes a softening/annealing means (51) in which the copper wire (1a) is softened by annealing to reduce the proof stress. The copper wire (1a, 1b) having the lowered proof stress is wound by the winding means (71) at winding force lower than the proof stress of the copper wire (1a, 1b). The softening/annealing means (51), plating means (61), and winding means (71) have been arranged in series in this order from the upstream side along the running direction of the copper wire (1a, 1b).