Inclusion complexes, the curing agent, curing accelerator, an epoxy resin composition and a semiconductor encapsulating epoxy resin composition

摘要

As for topic of this invention, controlling the hardening reaction in low temperature, as it assures the improvement of can stability (1 liquid stability), there are times when it offers the inclusion complex which effectively can make the resin harden by administering heating processing. As for the inclusion complex which is suited for that,(B1) at least 1 where it is chosen from the group which consists of aliphatic polyvalent carboxylic acid, 5 nitro isophthalic acid, 5 tert butyl isophthalic acid, 5 hydroxy isophthalic acid, isophthalic acid, and benzophenone 4,4'' di-carboxylic acid kinds and,(B2) at least 1 where it is chosen from the imidazole chemical compound which is displayed with below-mentioned formula (i) and the group which consists of the 1,8 jiazabishikuro [5.4.0] undesen 7 kinds,With it is the inclusion complex which features that it contains at mol ratio of the 1:1. Conversion 1