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INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR
INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR
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机译:包封半导体的包合物,固化剂,固化促进剂,环氧树脂组合物和环氧树脂组合物
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摘要
It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4'-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.
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