INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR

摘要

An object of the present invention is to inhibit the curing reaction at a low temperature, the storage stability (one liquid stability) with domoham improvement, by carrying out the heat treatment, can effectively in providing inclusion complexes capable of curing the resin. There are suitable inclusion complexes (b1) an aliphatic polyvalent carboxylic acid, 5-nitro-isophthalic acid, 5-tert- butyl-isophthalic acid, 5-hydroxy-isophthalic acid, isophthalic acid, and benzophenone-4,4'-dicarboxylic and at least one member selected from the group consisting of acid, (b2) the formula (I) Imidazole compounds and 1,8-diazabicyclo represented by the [5.4.0] and at least one selected from the group consisting of undecene-7 1: inclusion complexes, characterized in that it contains a molar ratio of 1