Adhesion holding method for thin plate workpiece, adhesion holding device for thin plate workpiece, and manufacturing system

摘要

Adhering and holding the thin plate workpiece without damaging it corrects the self-weight deflection of the thin plate workpiece. In the thin plate-like workpiece W partially supported by the lattice-like support member 1, the adhesive means 2 is moved closer to the non-supported portion W1 which is bent and deformed downward by its own weight in the direction intersecting the thin plate-like workpiece W. Then, a part of the adhesive surface 2a of the adhesive means 2 is brought into contact with the unsupported part W1, and then the adhesive surface 2a is moved so that the contact area between the adhesive surface 2a and the unsupported part W1 gradually increases. As a result, the adhesive surface 2a gradually comes in contact with the unweighted portion W1 due to its own weight deflection, and the external load on the thin plate-like workpiece W is extremely reduced, and the adhesive surface 2a Substantially the whole is brought into contact with the unsupported portion W1 and is held by adhesion. Thereafter, the adhesive means 2 is moved in the direction opposite to the approaching movement to the position where the adhesive surface 2a is flush with the support portion W2 supported by the support member 1 on the thin plate-like workpiece W. Thereby, the self-weight bending of the unsupported part W1 is reduced, and the entire thin plate workpiece W is adhered and held in a planar shape.