It is low, in regard to copper wiring the metal layer which at least contains the metal component of 1 where it is chosen from

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has low dielectric loss and low conductor loss and has high adhesive strength between copper wiring and an insulating layer and has a chemically stable adhesion interface, and to provide a copper foil, a laminate and a wiring board used for the multilayer wiring board.;SOLUTION: Copper wiring or copper foil and an insulating layer composed of a low-dielectric-loss material is joined via an adhesion interface having a multilayer structure which includes: a metal layer (A) containing at least one kind of metal component selected from among tin, nickel, chromium, zinc, cobalt and aluminum; a layer of oxide and/or a layer of hydroxide (B) of the metal component of the metal layer on the metal layer (A); an amine-based silane coupling agent layer (C) on the layer (B); and a vinyl-based silane coupling agent layer (D) on the layer (C).;COPYRIGHT: (C)2011,JPO&INPIT