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The junction mannered null average primary particle diameter which uses the low temperature sintering Characteristic jointing material and
The junction mannered null average primary particle diameter which uses the low temperature sintering Characteristic jointing material and
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机译:使用低温烧结特性连接材料和
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摘要
In addition to exhibiting a bonding strength capable of withstanding practical use without performing a heat treatment operation at high temperature and pressure bonded body formed in nitrogen is possible and to provide a bonding material having reduced junction variation between samples thing. As a component of the bonding material, an average primary particle size of a 1~200nm, silver nanoparticles are coated with an organic substance having 8 or less carbon atoms, dispersion media, carboxyl and at least two having a boiling point of 203 ℃ or I use a bonding material that is configured to include a flux component made of an organic material having a group. In particular, the use of a sub-micron silver particles and silver nano-particles.
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