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The junction mannered null average primary particle diameter which uses the low temperature sintering Characteristic jointing material and

机译:使用低温烧结特性连接材料和

摘要

In addition to exhibiting a bonding strength capable of withstanding practical use without performing a heat treatment operation at high temperature and pressure bonded body formed in nitrogen is possible and to provide a bonding material having reduced junction variation between samples thing. As a component of the bonding material, an average primary particle size of a 1~200nm, silver nanoparticles are coated with an organic substance having 8 or less carbon atoms, dispersion media, carboxyl and at least two having a boiling point of 203 ℃ or I use a bonding material that is configured to include a flux component made of an organic material having a group. In particular, the use of a sub-micron silver particles and silver nano-particles.
机译:除了在高温下不进行热处理就可以显示出可以承受实际使用的结合强度,还可以提供由氮形成的结合体,并且可以提供减少样品之间的接合变化的结合材料。作为键合材料的成分,平均一次粒径为1〜200nm,银纳米颗粒涂有碳原子数为8或更少的有机物质,分散介质,羧基和至少两种沸点为203℃或我使用一种粘合材料,该材料配置为包括由具有基团的有机材料制成的助焊剂成分。特别地,使用亚微米银颗粒和银纳米颗粒。

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