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Airtight neutron leakage survey instrument of wafer and airtight neutron leakage inspection manner of wafer

机译:晶片气密中子泄漏测量仪及晶片气密中子泄漏检查方法

摘要

P To provide a means that makes it possible to confirm a state of airtightness before an electronic component is completed to improve productivity of the electronic component. PSOLUTION: The airtightness leak inspection device for wafer that inspects an airtightness leak in the wafer having a tapered through hole wherein a metal material is buried includes a pressure operating-side adapter 110 coming into contact with an outer peripheral edge of one principal surface of the wafer to form a pressure operating space and a pressure measuring means 120 of measuring the pressure in the pressure operating space of the pressure operating-side adapter 110, a flow rate measuring-side adapter 130 coming into contact with an outer peripheral edge of the other principal surface of the wafer to form a flow rate measuring space and a flow rate measuring means 140 of measuring the flow rate of a fluid flowing in the flow rate measuring-side adapter 130. PCOPYRIGHT: (C)2010 and JPO& INPIT
机译:

提供一种装置,该装置可以在完成电子部件之前确认气密状态,以提高电子部件的生产率。

解决方案:用于检查具有锥形通孔的晶片中的气密性泄漏的晶片的气密性泄漏检查装置,该气密性检查装置埋入有金属材料,该气密性检查装置包括与一个主体的外周边缘接触的压力操作侧适配器110。在晶片的表面上形成压力工作空间,以及测量压力工作侧适配器110的压力工作空间中的压力的​​压力测量装置120,流量测量侧适配器130与外周边缘接触。晶片的另一个主表面形成流量测量空间,以及用于测量在流量测量侧适配器130中流动的流体的流量的流量测量装置140。

版权:(C)2010和JPO&INPIT

著录项

  • 公开/公告号JP5379437B2

    专利类型

  • 公开/公告日2013-12-25

    原文格式PDF

  • 申请/专利号JP20080254795

  • 发明设计人 那須 義紀;

    申请日2008-09-30

  • 分类号H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 16:11:01

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