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Method for producing a copper composite particles, method for producing a composite metal copper particles, method for producing a copper paste and metallic copper conductor

机译:铜复合粒子的制造方法,复合金属铜粒子的制造方法,铜浆和金属铜导体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for producing copper composite particles which can form a metal copper conductor of copper whose volume resistivity is suppressed, to provide a method for producing composite metal copper particles, to provide copper paste containing the copper composite particles or composite metal copper particles, and to provide a method for producing a metal copper conductor using the copper paste.;SOLUTION: Regarding the copper composite particles, copper hydride fine particles in which the average particle diameter of the secondary particles is 20 to 350 nm are stuck to the surfaces of metal copper particles in which the average particle diameter of the primary average particle diameter is 1 to 20 μm. The method for producing the copper composite particles includes: a step (I) where, from a solution in which a water soluble copper compound is dissolved and a reducing agent, a reaction system to produce a copper hydride fine particle in which the secondary particle diameter is 20 to 350 nm is formed; a step (II) where, into the reaction system, metal copper particles in which the average particle diameter of the primary particles is 1 to 20 μm are made to exist, copper composite particles in which the copper hydride fine particles are stuck to the surfaces of the metal copper particles are produced and, on the surfaces of the metal copper particles, copper composite particles in which copper hydride fine particles are stuck are formed; and a step (III) where the copper composite particles are separated from the reaction system are performed so as to obtain the objective copper composite particles.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种制造能够形成体积电阻率被抑制的铜的金属铜导体的铜复合颗粒的方法,提供一种制造复合金属铜颗粒的方法,提供一种包含铜复合颗粒或铜的铜浆。复合金属铜颗粒,并提供一种使用铜浆生产金属铜导体的方法。;解决方案:对于铜复合颗粒,二次颗粒的平均粒径为20至350 nm的氢化铜微粒是附着在一次平均粒径的平均粒径为1〜20μm的金属铜粒子的表面上。铜复合颗粒的制造方法包括:步骤(I),其中,从其中溶解有水溶性铜化合物的溶液和还原剂,通过反应体系制备氢化铜细颗粒,其中二次粒径形成20至350nm;在工序(II)中,使一次粒子的平均粒径为1〜20μm的金属铜粒子存在于反应体系中,使氢化铜微粒附着于铜复合粒子上。产生金属铜粒子的表面,并在金属铜粒子的表面上形成粘贴有氢化铜微粒的铜复合粒子。进行步骤(III),将铜复合颗粒从反应体系中分离出来,得到目标铜复合颗粒。;版权所有:(C)2011,JPO&INPIT

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