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SINGLE RETICLE APPROACH FOR MULTIPLE PATTERNING TECHNOLOGY
SINGLE RETICLE APPROACH FOR MULTIPLE PATTERNING TECHNOLOGY
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机译:多重图案化技术的单掩模版方法
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摘要
A reticle for multiple patterning a layer of an integrated circuit die includes a first portion with a first layout pattern for multiple patterning the layer of the integrated circuit die, and a second portion with a second layout pattern for multiple patterning the layer of the integrated circuit die. The first layout pattern is different from the second layout pattern.
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