首页> 外国专利> Metallic housing, method for making the same and electronic device using the same

Metallic housing, method for making the same and electronic device using the same

机译:金属外壳,其制造方法以及使用该金属外壳的电子设备

摘要

A metallic housing for an electronic device, the metallic housing includes a main body defining a receiving chamber for receiving electronic components and an opening communicating with the receiving chamber, and a covering plate positioned on the main body adjacent to a side of the main body. The covering plate is welded to the main body by friction stir welding and a welded region is formed on a side surface of the metallic housing such that the welded region is smooth with the main body and the covering plate. A method for making the metallic housing and an electronic device using the metallic housing is also disclosed.
机译:一种用于电子设备的金属外壳,该金属外壳包括:主体,该主体限定用于接收电子部件的接收室;以及与该接收室连通的开口;以及盖板,该盖板位于该主体上并邻近该主体的侧面。通过摩擦搅拌焊接将盖板焊接到主体,并且在金属壳体的侧表面上形成焊接区域,使得焊接区域与主体和盖板是光滑的。还公开了一种用于制造金属外壳的方法和使用该金属外壳的电子设备。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号