Pharmaceutical composition with antibody that binds to heat shock protein 27(HSP270) and method for promoting wound healing

摘要

The present invention relates to a pharmaceutical composition for promoting angiogenesis, containing an antibody that specifically binds to heat shock protein (HSP) 27. In addition, the present invention relates to a pharmaceutical composition containing an antibody that specifically binds to HSP 27, for treating an angiogenesis-dependent ailment selected from a group consisting of a wound, chronic ulcer, ischemic stroke, myocardial infarction, angina pectoris, and cerebrovascular dementia. In addition, the present invention relates to a method for promoting the in vitro growth of endothelial cells using an antibody that specifically binds to HSP27. In addition, the present invention relates to a method for screening for active substances for promoting angiogenesis or for active substances for treating an angiogenesis-dependent ailment, the method comprising the following steps: treating vascular endothelial cell lines with each specimen; measuring the content of HSP27 in the respective vascular endothelial cell lines; and selecting a specimen in which the HSP27 content in the vascular endothelial cell lines are decreased as compared to a control group.