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Wafer-level interconnect for high mechanical reliability applications
Wafer-level interconnect for high mechanical reliability applications
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机译:晶圆级互连,用于高机械可靠性应用
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摘要
An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.
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