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Method of computing a width of a scribe region based on a bonding structure that extends into the scribe reigon in a wafer-level chip scale (WLCSP) packaging
Method of computing a width of a scribe region based on a bonding structure that extends into the scribe reigon in a wafer-level chip scale (WLCSP) packaging
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机译:基于延伸到晶圆级芯片规模(WLCSP)封装的划线区域的键合结构计算划线区域宽度的方法
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摘要
The disclosed WLCSP solution overcomes the limitations of fan-out WLCSP solutions, and other conventional solutions for WLCSP for small, high volume die, by increasing the width of scribe regions between die on a semiconductor substrate to accommodate bonding structures (e.g., solder balls) that partially extend beyond peripheral edges of the die. The scribe regions can be widened in x and y directions on the wafer. The widened scribe regions can be incorporated into the design of the mask set.
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