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Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers

机译:形成不对称间隔物的方法和使用不对称间隔物的半导体器件的制造方法

摘要

A method of fabricating asymmetrical spacers, structures fabricated using asymmetrical spacers and an apparatus for fabricating asymmetrical spacers. The method includes: forming on a substrate, a structure having a top surface and opposite first and second sidewalls and having a longitudinal axis parallel to the sidewalls; forming a conformal layer on the top surface of the substrate, the top surface of the structure and the sidewalls of the structure; tilting the substrate about a longitudinal axis relative to a flux of reactive ions, the flux of reactive ions striking the conformal layer at acute angle; and exposing the conformal layer to the flux of reactive ions until the conformal layer is removed from the top surface of the structure and the top surface of the substrate leaving a first spacer on the first sidewall and a second spacer on the second sidewall, the first spacer thinner than the second spacer.
机译:一种非对称间隔物的制造方法,使用非对称间隔物制造的结构以及用于制造非对称间隔物的设备。该方法包括:在基板上形成具有顶表面以及相对的第一和第二侧壁并且具有平行于侧壁的纵轴的结构;在基板的顶表面,结构的顶表面和结构的侧壁上形成保形层;相对于反应离子通量使衬底绕纵轴倾斜,反应离子通量以锐角撞击保形层。使该共形层暴露于反应离子流中,直到该共形层从该结构的顶表面和衬底的顶表面被去除,从而在第一侧壁上留下第一间隔物,在第二侧壁上留下第二间隔物,第一间隔物比第二间隔物薄。

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