Circuit assembly yield prediction with respect to manufacturing process

摘要

Embodiments of the invention include systems and methods for automatically predicting production yield for a circuit assembly according to attributes of its components and defect data mapped thereto. Embodiments receive a proposed design specification for a circuit assembly, including bill of materials (BOM) and schematic data, at a yield prediction environment. The yield prediction environment maps a set of attributes to each component in the BOM and maps a set of possible defects to each component according to its attributes. Defects may be further mapped to a manufacturing process assigned to populate each component in the circuit assembly. The defects are associated with predicted frequencies of occurrence, which can be used to roll up a yield prediction for the circuit assembly. Embodiments further allow “what-if” analyses to be performed so that different yield prediction results can be compared according to different form factor options and/or different manufacturing process options.