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SOURCE OF PLASMA FOR APPLICATION OF THIN-FILM COATINGS USING PLASMA AND CHEMICAL DEPOSITION FROM THE GAS PHASE (OPTIONS)

机译:等离子体来源和用于气相沉积和化学沉积的薄膜涂层(可选)

摘要

The application describes new plasma sources suitable for use in thin-film coating technology and methods of using these sources. In particular, the present invention proposes new linear and two-dimensional plasma sources, which create a linear and two-dimensional plasma, respectively, which is suitable for plasma-chemical deposition from the gas phase.
机译:该申请描述了适用于薄膜涂覆技术的新等离子体源以及使用这些等离子体源的方法。特别地,本发明提出了新的线性和二维等离子体源,其分别产生线性和二维等离子体,其适合于从气相进行等离子体化学沉积。

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