首页> 外国专利> TOPOLOGY CIRCUIT OF A HIGH GAIN VOLTAGE AMPLIFIER WITH DOUBLE SUM OF TRANSCONDUCTANCE AND ROBUST TO PROCESS, VOLTAGE AND TEMPERATURE VARIATIONS.

TOPOLOGY CIRCUIT OF A HIGH GAIN VOLTAGE AMPLIFIER WITH DOUBLE SUM OF TRANSCONDUCTANCE AND ROBUST TO PROCESS, VOLTAGE AND TEMPERATURE VARIATIONS.

机译:高导通电压放大器的拓扑电路,其导通和过程,电压和温度变化具有双导数和鲁棒性。

摘要

The present invention refers to a high gain voltage amplifier robust to PVT variations. The gain of the present invention is provided by the double sum of transconductance in two stages. In addition, the characteristic of robustness before PVT variations (specifically the gain parameter), is achieved according to a topological condition, this does not requiring calibrating, sensing or controlling circuits, which may increase the complexity, power consumption and area. On the other hand, the circuit is functional even in nanometric technologies different from CMOS, such as the SOI technology, where it was correctly proved at a scale of 45 nanometers.
机译:本发明涉及对PVT变化具有鲁棒性的高增益电压放大器。本发明的增益由两个阶段的跨导的两倍总和提供。另外,根据拓扑条件获得PVT变化之前的鲁棒性的特征(具体地,增益参数),这不需要校准,感测或控制电路,这可能会增加复杂性,功耗和面积。另一方面,该电路即使在不同于CMOS的纳米技术(例如SOI技术)中也能正常工作,而SOI技术已在45纳米的规模上得到了正确证明。

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