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Dynamic system for variable heating or cooling of linearly transported substrates

机译:动态系统,用于可变加热或冷却线性输送的基材

摘要

A system is provided for heating or cooling discrete, linearly conveyed substrates having a gap between a trailing edge of a first substrate and a leading edge of a following substrate in a conveyance direction. The system includes a chamber, and a conveyor operably configured within the chamber to move the substrates through at a conveyance rate. A plurality of individually controlled temperature control units, for example heating or cooling units, are disposed linearly within the chamber along the conveyance direction. A controller is in communication with each of the temperature control units to sequentially cycle output of the units from a steady-state temperature output along the conveyance direction as a function of position of the leading and trailing edges of the substrates within the chamber relative to the temperature control units so as to reduce edge-induced temperature variances in the substrates.
机译:提供一种用于加热或冷却离散的,线性输送的基板的系统,该系统在输送方向上在第一基板的后缘和后续基板的前缘之间具有间隙。该系统包括腔室,以及可操作地配置在腔室内以使基板以传送速率移动通过的传送器。多个单独控制的温度控制单元,例如加热或冷却单元,沿着传送方向线性地布置在腔室内。控制器与每个温度控制单元通信,以根据在腔室内基板的前缘和后缘相对于基板的位置的变化,从沿着传送方向的稳态温度输出顺序地循环这些单元的输出。温度控制单元,以减少基板中边缘引起的温度变化。

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