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dynamic system for heating or cooling substrates varying linearly transported

机译:动态系统,用于加热或冷却线性变化的基材

摘要

dynamic for heating or variable cooling of substrates transported linearly system. # a system (100) for heating or cooling substrates (108) discrete, transported linearly, with a gap (114) between a trailing edge (112) is provided a first substrate and a leading edge (110) of a subsequent substrate in a transport direction. The system includes a camera (102) and a conveyor (132) operably configured within the chamber for moving substrates through it at a speed of transport. A plurality of units of temperature control (116) individually controlled, for example, heating or cooling units, are linearly arranged within the chamber along the conveying direction. A controller (118) is in communication with each of the control units of temperature (116) for circulating sequentially output unit from an output of steady state temperature along the conveying direction as a function of the position of the leading and trailing edges of the substrates within said chamber relative to said control units with temperature to reduce temperature variations induced by the edges on the substrates.
机译:动态加热或线性移动底材的可变冷却系统。 #提供了用于加热或冷却离散的,线性地运输的基板(108)的系统(100),该系统(100)在后缘(112)之间具有间隙(114),在该基板中提供第一基板和后续基板的前缘(110)。运输方向。该系统包括摄像机(102)和可操作地配置在腔室内的传送器(132),用于以传送速度使基板通过它移动。分别被控制的多个温度控制单元(116),例如加热或冷却单元,沿着传送方向线性地布置在腔室内。控制器(118)与温度控制单元(116)的每一个通信,以根据基板的前缘和后缘的位置从沿着传送方向的稳态温度的输出顺序地循环输出单元相对于所述控制单元在所述腔室内具有温度,以减少由基板上的边缘引起的温度变化。

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