DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURING METHOD, AND ROOM-TEMPERATURE BONDING APPARATUS

摘要

An inter-substrate material layer is formedbetween a first substrate and a second substrate togenerate a bonding strength. A plurality of metalelements are present in the inter-substrate materiallayer. An interface element existence ratio of theplurality of metal elements is 0.07 or above. Adevice can be obtained in which substrates difficultto bond (for example, SiO2 substrates) are bonded atroom-temperature to have practical bonding strength.