RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES

摘要

A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being atleast two, and includes N generally planar patches, and at least one generallyplanar ground plane. The ground plane is formedwith at least N coupling aperture slots therein. N feed lines are spacedinwardly from the ground plane and substantially parallelthereto, and at least one radio-frequency chip is spaced inwardly from thefeed lines and coupled to the feed lines and the groundplane. A first substrate layer is formed with the chip located in a chip-receiving cavity. A second substrate layer is interposed be-tweenthe ground plane and a plane defined by the patch. The patch is formed in afirst metal layer, the ground plane in a secondmetal layer, and the second substrate layer defines an antenna cavity in whichthe N generally planar patches are located.