PROCESS FOR PRODUCING HEAT-DISSIPATION STRUCTURE OF LED LUMINAIRE FORMED BY SOLDERING COPPER SUBSTRATE AND ALUMINUM BASE

摘要

Disclosed is a process for producing the heat-dissipation structure of an LED luminaire formed by soldering a copper substrate and an aluminum base. The process comprises the steps of: nickel plating (step 101): plating a nickel layer on the surface of an aluminum base; smearing a solder paste on the aluminum base (step 102): removing the residues on the surface of the nickel plated layer of the aluminum base and evenly laying a layer of chloride-free and lead-free solder paste on the nickel-plated layer; smearing a solder paste on the copper substrate (step 103): removing the residues on the surface of the copper substrate and evenly laying a layer of chloride-free and lead-free solder paste on the cleaned surface; heating and soldering (step 104): fitting together the side of the copper substrate laid with the solder paste and the surface of the aluminum base laid with the solder paste, and then putting the assembly of the copper substrate and the aluminum base into a thermostat station to heat such that the solder paste layer on the copper substrate and the solder paste layer on the aluminum base are fused together; cooling (step 105): taking the assembly of the copper substrate and the aluminum base out of the thermostat station to cool to room temperature, so as to obtain the heat-dissipation structure of the LED luminaire formed by soldering a copper substrate and an aluminum base. The present process uses solder pastes to solder the aluminum base and the copper substrate, has a good heat-dissipation effect, and will not affect the service life of the LED due to a high junction temperature produced by the heat-dissipating binder.