MICROPHONE ARRANGEMENT COMPRISING A STACK OF MEMS -MICROPHONE AND INTERFACE - CHIP

摘要

A microphone arrangement comprises a stack, the stack further comprising a MEMS microphone (1) and a MEMS interface (2). The MEMS microphone (1) comprises a semiconductor body having a movable member (11) on a first main surface (12) and the MEMS interface (2) comprises another semiconductor body having contact pads (21) on a second main surface (22). The MEMS microphone (1) and the MEMS interface (2) are electrically connected via the contact pads (21) with the first main surface (12) facing the second main surface (22).