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BASE SHEET FOR ELECTRONIC COMPONENT PACKAGING, MULTILAYER SHEET FOR ELECTRONIC COMPONENT PACKAGING, CARRIER TAPE FOR ELECTRONIC COMPONENT PACKAGING, AND ELECTRONIC COMPONENT CARRIER
BASE SHEET FOR ELECTRONIC COMPONENT PACKAGING, MULTILAYER SHEET FOR ELECTRONIC COMPONENT PACKAGING, CARRIER TAPE FOR ELECTRONIC COMPONENT PACKAGING, AND ELECTRONIC COMPONENT CARRIER
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机译:电子组件包装的基本表,电子组件包装的多层表,电子组件包装的载带和电子组件载具
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摘要
Provided are: a base sheet for electronic component packaging, which is reduced in the effect of punching conditions on burr formation; a multilayer sheet for electronic component packaging; a carrier tape for electronic component packaging, and an electronic component carrier. This base sheet for electronic component packaging is configured of a resin composition that contains a polystyrene resin (A) and an impact-resistant polystyrene resin (B), and is characterized in that the content of the polystyrene resin (A) is from 1% by weight to 50% by weight (inclusive) and the content of the impact-resistant polystyrene resin (B) is from 50% by weight to 99% by weight (inclusive).
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