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SiGe STRAIN RELAXED BUFFER FOR HIGH MOBILITY DEVICES AND A METHOD OF FABRICATING IT

机译:用于高移动性设备的SiGe应变松弛缓冲器及其制造方法

摘要

The invention relates to a semiconductor device comprising a semiconductor substrate and having on its top at least a Thin Strain Relaxed Buffer, consisting essentially of a stack of three layers, characterized in that the Thin Strain Relaxed Buffer is not an active part of the semiconductor device and in that said three layers defining the Thin Strain Relaxed Buffer have an essentially constant Ge concentration, said three layers being: - a first epitaxial layer of Si1-xGex, x being the Ge concentration; - a second epitaxial layer of Si1-xGex: C on said first epitaxial layer, the amount of C being at least 0.3 %; - a third epitaxial layer of Si1-xGex on said second layer.
机译:半导体器件技术领域本发明涉及一种半导体器件,该半导体器件包括半导体衬底并且在其顶部上至少具有薄应变松弛缓冲器,该薄应变松弛缓冲器基本上由三层堆叠构成,其特征在于,该薄应变松弛缓冲器不是半导体器件的有源部分。并且,所述限定薄应变松弛缓冲液的所述三层具有基本恒定的Ge浓度,所述三层为:-Si 1-x Gex的第一外延层,x为Ge浓度; -在所述第一外延层上的Si1-xGex的第二外延层:C,C的含量至少为0.3%; -在所述第二层上的Si1-xGex的第三外延层。

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