GLASS SUBSTRATE FOR COVER GLASS FOR ELECTRONIC DEVICE, COVER GLASS FOR ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING GLASS SUBSTRATE FOR COVER GLASS FOR ELECTRONIC DEVICE

摘要

The present invention provides a glass substrate for a cover glass for an electronic device, in which the strength of an end face having an apex is enhanced. This glass substrate has a pair of end faces adjoining a principal surface, and the end faces are shaped having an apex as viewed in cross-section and have a compressive stress layer due to chemical strengthening, the maximum compressive stress being 600 MPa or greater, and the depth of the compressive stress layer being 60 µm or less. The apex angle θ (degrees) of the apex, the maximum compressive stress (CS) [MPa] of the surface, and the depth (d) [µm] of the compressive stress layer satisfy the relationship 600 MPa ≤ -3.5 × {(d/sin(θ/2)) - d} + CS.