Processing detector array signals using stacked readout integrated circuits

摘要

According to certain embodiments, an apparatus comprises a first readout integrated circuit (ROIC) (20), a second ROIC (22), and a dual band detector array (24). The first ROIC comprises first unit cells (40). The second ROIC is disposed outwardly from the first ROIC and comprises a second unit cells (42). Electrically conductive vias (50) are disposed through the second ROIC and at least into the first ROIC. The detector array (24) is disposed outwardly from the second ROIC (22). The detector array is configured to detect high dynamic range infrared light and comprises detector pixels (38). Each detector pixel is configured to generate a current in response to detecting light and send the current to a via. A via is configured to send the signal to a second unit cell and a first unit cell.