The present invention provides an interactive integrated learning platform providing holistic learning experience to science and technology students. In one embodiment, the present invention provides a product application center (PAC) displaying cut sections and tear down grid of physical products selected from various industries. The product application center enables students to experience touch and feel for core concepts such as mechanical, electrical, electronics, etc. In the present invention, either teardown or combination of teardown and cut section views of products is displayed in the PAC. These cut sections and teardown grids are connected to a virtual seamlessly connected virtual information center (described below) using appropriate tags/IDs. These tags support seamless connection of information from the virtual application center to physical girds and cut sections (vice-versa) placed in the PAC. Thus, the seamlessly connected virtual information center facilitates immediate learning and understanding of engineering subjects at a topic/subtopic level.
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