首页> 外国专利> LED LIGHT SOURCE STRUCTURE WITH HIGH ILLUMINATING POWER AND IMPROVED HEAT DISSIPATING CHARACTERISTICS

LED LIGHT SOURCE STRUCTURE WITH HIGH ILLUMINATING POWER AND IMPROVED HEAT DISSIPATING CHARACTERISTICS

机译:具有高发光功率和改善的散热特性的LED光源结构

摘要

The present invention relates to an LED light source structure, and more particularly, to an LED light source structure with high illuminating power and improved heat dissipating characteristics, in which metal having superior electric conductivity and thermal conductivity is processed into positive electrode units, and heat generated from an LED chip is directly dissipated through the electrode unit which is used as a positive electrode from among the positive electrode units, thereby improving heat dissipating characteristics, stabilizing a light source and preventing voltage drop, thus enabling output of high illuminating power. The LED light source structure with high illuminating power and improved heat dissipating characteristics is configured in that the LED chip is arranged and heat generated when the LED chip is turned on is dissipated to the outside, wherein the LED light source structure comprises: a first electrode unit 10 made of an electrically conductive material; a second electrode unit 20 made of an electrically conductive and thermally conductive material and electrically insulated from the first electrode unit 10; and an LED chip 40 arranged to use the first electrode unit 10 and the second electrode unit 20 as a positive electrode, wherein the first electrode unit 10 and the second electrode unit 20 are arranged to be brought into surface-contact with the LED chip 40, thus enabling heat generated from the LED chip 40 to be directly conducted and dissipated into the atmosphere.
机译:LED光源结构技术领域本发明涉及一种LED光源结构,更具体地,涉及一种具有高照明功率和改善的散热特性的LED光源结构,其中,将具有优异的导电性和导热性的金属加工成正极单元,并进行散热。从LED芯片产生的光通过正电极中的被用作正电极的电极单元直接消散,从而改善了散热特性,稳定了光源并防止了电压下降,从而能够输出高照明功率。具有高照明功率和改善的散热特性的LED光源结构被配置为:布置LED芯片并且将在打开LED芯片时产生的热量散发到外部,其中,LED光源结构包括:第一电极单元10由导电材料制成;第二电极单元20由导电且导热的材料制成并且与第一电极单元10电绝缘。以及使用第一电极单元10和第二电极单元20作为正极的LED芯片40,其中第一电极单元10和第二电极单元20被布置为与LED芯片40表面接触。因此,能够使从LED芯片40产生的热量直接传导并散发到大气中。

著录项

  • 公开/公告号EP2618050A4

    专利类型

  • 公开/公告日2014-08-27

    原文格式PDF

  • 申请/专利权人 BK TECHNOLOGY CO. LTD.;

    申请/专利号EP20110825425

  • 发明设计人 LEE DONG WOO;

    申请日2011-09-14

  • 分类号F21V29;F21Y101/02;H01L33/64;

  • 国家 EP

  • 入库时间 2022-08-21 15:48:28

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