CHEMICAL PEEL-OFF METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE

摘要

PURPOSE: A flexible electronic device manufacturing method which uses a chemical stripping method, a flexible electronic device, and a flexible substrate are provided to arrange the electronic device on a separation surface which has surface roughness approximately equivalent to a back panel in which an exfoliation layer is coated, thereby easily solving a surface roughness problem of a metal flexible substrate. CONSTITUTION: An exfoliation layer(500) is arranged on a back panel(100). A flexible substrate(200) is formed on the exfoliation layer. A temporary substrate is attached on the flexible substrate using a bonding layer. The back panel and the flexible substrate are separated by chemically separating a part or whole of the exfoliation layer. An electronic device(300) and an encapsulation layer(400) are formed on a separation surface of the flexible substrate attached on the pack panel.