The present invention provides an electromagnetic levitation metal thin film deposition apparatus and a deposition method for an electromagnetic levitation metal thin film. The apparatus includes: a chamber exhausting air so as to prevent the generation of plasma; a dielectric tube mounted around a through hole formed in the chamber; an electromagnetic levitation coil surrounding the dielectric tube; an RF power providing RF electric power to the electromagnetic levitation coil; a substrate holder arranged in the chamber at the location lower than a plane surface on which the dielectric tube is arranged; and a substrate arranged on the substrate holder. The electromagnetic coil includes an upper electromagnetic levitation coil and a lower electromagnetic levitation coil continuously connected with each other. The direction of current flowing in the upper electromagnetic levitation coil and the direction of current flowing in the lower electromagnetic levitation coil are opposite to each other. The electromagnetic levitation coil levitates and heats a metal sample arranged in the dielectric tube using electromagnetic force. The metal sample evaporates and moves in the gravity direction and then forms a metal thin film on a substrate.
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