MANUFACTURING METHOD OF ULTRAFINE CIRCUIT BOARD WITH INTEGRATED POLYIMIDE RESIN PART AND CONDUCTIVE CIRCUIT PART AND ULTRAFINE CIRCUIT BOARD

摘要

The present invention relates to an ultrafine circuit board with an integrated a polyimide resin part and conductive circuit part. The polyimide resin part and the conductive circuit part are integrated on one surface of a polyimide film. The polyimide resin part is formed between circuits in the conductive circuit part. The polyimide resin part and the conductive circuit part are attached to a polyimide film. A manufacturing method of the ultrafine circuit board with an integrated non-conductive material-filled part and conductive circuit part comprises a photoresist-spreading process spreading photoresist onto a conductive board; an exposure process forming an exposed part and unexposed part by irradiating the photoresist with light through a patterned film; a space part-forming process for forming a space part by removing the unexposed part; a circuit part-forming process for forming a circuit part by a plating method; a space part-forming process for forming a space part by chemically removing an exposed part; a polyimide resin-filling process for filling a liquid polyimide resin into the upper part of the conductive circuit part; a film-attaching process attaching a polyimide film onto the liquid polyimide resin; and a conductive board-removing process for removing the conductive board.;COPYRIGHT KIPO 2014