ENCAPSULANT FOR PACKAGING AN ORGANIC ELECTRIC DEVICE, METHOD FOR PREPARING THE SAME, METHOD FOR ENCAPSULATING THE ORGANIC ELECTRIC DEVICE BY USING THE SAME AND ORGANIC ELECTRIC DEVICE PACKAGED BY THE SAME

摘要

The present invention relates to a method for manufacturing a Fe-Ni alloy substrate used in a flexible OLED display by electro-foaming and a substrate having excellent surface roughness by continuous electrolytic polishing. In particular, the present invention has high productivity, delamination of the substrate can be easily achieved by using electrolytic polishing, and nano-level surface roughness can be economically obtained since the substrate can be manufactured with a simple process compared to a conventional rolling process by using electro-foaming. When manufacturing an OLED by using the metal substrate of the present invention, lifespan of the OLED device can be greatly increased since moisture prevention properties which affect the life property of the OLED are excellent and heat dissipation characteristic is also excellent.