ENCAPSULANT FOR PACKAGING AN ORGANIC ELECTRIC DEVICE FOR DISPLAY WITH LOW THERMAL EXPANSION COEFFICIENT

摘要

The present invention relates to steel for an organic light emitting diode sealing material for a display having excellent thermal expansion coefficient properties at a high temperature. According to an embodiment of the present invention, the steel for an organic light emitting diode sealing material for a display includes: 0.02 wt% or less of C (excluding 0); 0.4 wt% of less of Si (excluding 0); 0.5 wt% or less of Mn (excluding 0); 3.0 or less wt% of Cr (excluding 0); 40-42 wt% of Ni; 0.6 or less of Co (excluding 0); residual Fe; and other inevitable impurities. The steel satisfies the formula (1) whereas Ni, Cr, and Si in the formula (1) represent the content of each element in wt%.